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• 04:51 27 oct 2025 AdelaideSizemore discusión contribs. creó la página Oxidation Occurs Rapidly At Elevated Temperature (Página creada con «<br>For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join. A cross-section through the failed joint shows a distinct boundary between the solder ball on the part and the solder paste on the circuit board, rather like a section through a head resting on a pillow. The defect can be caused by surface oxidation or poor we…»)